Analysis of Semiconductor 8 Major Processes and Leading Companies

 Semiconductors are the core components of electronic devices, and their manufacturing process requires extreme precision and advanced technology. The production of semiconductor chips involves Wafer Manufacturing → Oxidation → Photolithography → Etching → Ion Implantation → Deposition → Metallization → Packaging & Testing in eight major steps.

This article provides an in-depth analysis of the principles, latest trends, and competitive landscape of these eight major semiconductor processes.

1. Wafer Manufacturing

Process Overview

This process involves producing silicon wafers, which serve as the foundation of semiconductor chips.

  • Raw Material: High-Purity Silicon (Si, 99.9999999%)

  • Czochralski (CZ) Method: Silicon is melted and grown into a monocrystalline ingot

  • Slicing the Ingot to form wafers

  • Surface polishing and cleaning to remove impurities

  • Wafer size: Currently, 300mm (12-inch) wafers are dominant, with discussions on 450mm wafer development

Key Companies & Market Share

  • Shin-Etsu Chemical (Japan): World’s No.1 wafer producer (30% market share)

  • SUMCO (Japan): 25% global market share

  • SK Siltron (South Korea): 15% global market share, supplies to Samsung and TSMC

2. Oxidation

Process Overview

A process that forms an oxide layer on the wafer surface to create an insulating layer.

  • Thermal Oxidation: Uses oxygen or steam to convert silicon into SiO₂

  • Oxide layer function: Provides electrical insulation and prevents ion diffusion

  • Thin Film Oxidation Technology: ALD (Atomic Layer Deposition) is now used in advanced semiconductors

Key Companies & Market Share

  • Applied Materials (USA): 35% market share, leading oxidation equipment provider

  • Tokyo Electron (TEL, Japan): 20% market share, supplies CVD (Chemical Vapor Deposition) equipment

3. Photolithography

Process Overview

A key process that creates ultra-fine circuit patterns on wafers using light to expose a photosensitive material (photoresist).

  • EUV (Extreme Ultraviolet) Process: Uses 13.5nm wavelength EUV light to enable sub-5nm process nodes

  • DUV (Deep Ultraviolet) Process: Uses traditional ArF and KrF-based lithography

  • Mask Alignment: Ensures the precision of the photolithography process

Key Companies & Market Share

  • ASML (Netherlands): 100% EUV market share (monopoly)

  • Nikon (Japan), Canon (Japan): DUV lithography market share - Nikon (20%), Canon (10%)

4. Etching

Process Overview

Removes unwanted parts of the wafer based on the patterns created in the photolithography process.

  • Wet Etching: Uses chemical solutions to dissolve wafer surfaces

  • Dry Etching (Plasma Etching): Uses plasma-based ion reactions to remove material (essential for advanced nodes)

Key Companies & Market Share

  • Lam Research (USA): 45% market share, leading etching equipment provider

  • Applied Materials (USA): 35% market share, major supplier of etching and deposition tools

5. Ion Implantation

Process Overview

This process introduces specific element ions into the wafer to alter its electrical properties.

  • Doping Techniques: N-type (electron donors) and P-type (hole donors) doping to adjust electrical characteristics

  • Ion Acceleration Technology: Enables precise ion implantation to enhance semiconductor performance

Key Companies & Market Share

  • Axcelis Technologies (USA): 40% market share, major ion implantation equipment supplier

  • Applied Materials (USA): 30% market share, provides comprehensive semiconductor manufacturing solutions

6. Deposition

Process Overview

A process where thin films are deposited onto the wafer surface to improve its electrical and chemical properties.

  • CVD (Chemical Vapor Deposition): Uses chemical reactions to form uniform thin films

  • PVD (Physical Vapor Deposition): Deposits metal thin films using physical processes

Key Companies & Market Share

  • Applied Materials (USA): 40% market share

  • Tokyo Electron (Japan): 30% market share

7. Metallization (Interconnects)

Process Overview

Forms metal interconnects that allow electrical signals to travel within the semiconductor device.

  • Copper (Cu) Interconnects: Improves conductivity and enhances data transmission speed

Key Companies & Market Share

  • Applied Materials (USA): 45% market share

  • Tokyo Electron (Japan): 35% market share

8. Packaging & Testing

Process Overview

Protects semiconductor chips and prepares them for integration into electronic devices.

  • FCBGA (Flip Chip Ball Grid Array): A high-performance packaging technology

Key Companies & Market Share

  • ASE (Taiwan): 50% market share, leading semiconductor packaging provider

  • Amkor Technology (USA): 30% market share

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